Responsibilities:
1. Provide front-line support for the professional SoC design service and Star IPs including both digital and mixed-signal IPs;
2. Tasked with providing technical consultation, training and developing example systems and application notes for customers and licensees who are developing system-on-a-chip designs for communications and consumer systems and high performance embedded software.

Requirements:
1. Masters Degree in Electronics Engineering or Communications Engineering (Bachelors Degree considered if supported by 7+ years experience);
2. 5+ years post-graduate experience of communications or consumer chip system development based on MCU/DSP;
3. Knowledge on RTL and ASIC/SoC design;
4. Experience of embedded software development not essential but a definite advantage;
5. Good verbal and written communication in English and Mandarin essential;
6. Experience in a customer-facing role preferred.

职位描述：
1. 为芯片设计服务项目提供前、后端、系统软件技术评估服务，形成系统解决方案及项目建议，客户信息沟通及客户需求管理；
2. 为芯原GPU，DSP，VPU, NPU，ISP，混合信号等IP提供售前技术支持及解决方案建议服务。客户信息沟通及客户需求管理。

应聘要求：
1. 电子技术，计算机，自动化及通信等相关专业硕士学历（本科学历需有4年相关工作经验）；
2. 4年以上集成电路系统、SoC 芯片前后端设计、GPU/NPU/ISP/DSP/VPU 相关系统及软件开发经验；
3. 熟悉SOC、MCU，AP应用处理器等设计流程及芯片生产制造流程；
5. 中英文读写顺畅；
6. 能够适应国内商务出差及灵活的工作时间。
7. 具有良好的沟通协调能力、ASIC与IP销售支持服务和客户管理经验者优先考虑。