Position Description
The Field Applications Engineer will be responsible to support customer to
optimize and validate 3D Tomography FIB/SEM solutions for semiconductor lab/fab
applications. The work will be done primarily using existing and prototype
FIB-SEM based tools at the customer site.
Role / Responsibility
1、Obtain first-hand knowledge of semiconductor FIB-SEM applications at
customer sites and identify areas for improvement as well as new market
opportunities.
2、Work jointly & hands-on with internal hardware and software development
groups.
3、Perform customer tool acceptance on newly released products.
4、erform Applications Troubleshooting and follow-up reports with customers.
5、Provide applications training and technical support to customers.
6、Demonstration and testing in the field with customer samples
7、Feedback and get training for new operational technique and knowledge
8、Willingness to travel to visit work at customer sites and HQ
Qualification
1、Hands-on experience with SEM imaging and FIB-SEM sample preparation.
Preferably experience working with semiconductor devices.
2、Experience in Design of Experiments (DOE) and Statistical Process Control
(SPC).
3、Excellent communication skills, self-direction, integrity, positive
thinking, strong learning desires and good teamwork.
4、Understanding of metrology and defect review requirements and workflows of
semiconductor manufacturers
5、Experience in the field of 3D tomography with FIB SEM and 3D metrology
6、hands on experience with material analysis tools such as EDS or EBSD and
cryo system
7、experience analyzing semiconductor devices, especially DRAM and NAND
structures
8、Master or PhD Degree from “211” university in Engineering, Physics or
Chemistry. in material science, chemistry, physics or related subjects
9、English proficiency to support overseas customers and to communicate with HQ
team