Summary:
A discrete power device product engineer with certain work experience, responsible for the development of new discrete devices (such as SiC、GaN、SGT、SJ etc.), covering from target specification setting to large-scale production stage. The job responsibilities include testing plan design, product characterization verification and reliability assessment, improvement of product yield, resolution of various production related issues, and continuous quality improvement. 具备一定工作经验的分立功率器件产品工程师，负责分立器件（SiC、GaN、SGT、SJ等）新产品的开发工作，涵盖从目标规格设定到大规模量产阶段。工作内容包括测试计划设计、产品特性化验证和可靠性鉴定、产品良率的提升、生产相关的各类问题的解决以及持续的质量改进。

RESPONSIBILITIES:
1. Co-work with device design engineer, marketing engineer to finish device requirement analysis, competitor analysis, construction analysis, build up the product development target and plan. Product types include and not limited to SiC, GaN, SGT, SJ etc. 与器件设计工程师, 市场工程师共同完成器件设计需求分析、竞争对手分析、结构分析等，制定产品开发目标和计划。产品类型包括但不限于SiC、GaN、SGT、SJ等。
2. Collaborate with testing engineers to develop device testing plans and schemes, and complete testing verification.协同测试工程师制定器件测试计划和测试方案，完成测试验证。
3. Responsible for following up on the fab and packaging of new products throughout the process, and analyzing, identifying, and addressing various issues during the product preparation process. 负责全程跟进新产品的流片、封装，并分析、识别、处理产品制备过程中的各类问题。
4. Support product characterization, collaborate with design, application engineer to write the datasheet specifications. 完成产品特性验证，与设计、应用工程师合作编写数据表规范。
5. Complete product reliability testing and continuously promote product yield improvement.完成产品的可靠性测试并持续推进产品的良率改善。
6. Collaborate with internal team for engineering sample support and delivery. 协同内部团队，确保工程样品的按时交付；
7. Engage in solving all issues meet internal or external to improve the product quality across the product lifetime. 介入解决产品生命周期中面临的各种内部或外部问题，以提升产品质量；
8. Support on products subcon (fab/bumping/assembly/test etc.) transfer. 参与产品外包工厂(晶圆代工/凸点代工/封装/测试等)的迁移。

REQUIREMENTS:
1. Master's students majoring in microelectronics and related fields, with at least two years of work experience in domestic and international power device semiconductor companies preferred. 微电子及相关专业硕士研究生，有国内、国际功率器件半导体大厂工作两年以上经历者优先。
2. NPI experience of SiC, GaN, SGT MOS etc. products development is specially preferred. 有SiC、GaN、SGT MOS等产品开发NPI经验者尤佳。
3. Familiar with discrete power device product characterization and qualification (ESD/LU/HTRB/HTGB/H3TRB/IOL etc.). 熟悉分立功率器件的特性化验证和可靠性鉴定(ESD/LU/HTRB/HTGB/H3TRB/IOL etc.).
4. Strong experience in managing R&D projects, strong communication and coordination skills, excellent sense of responsibility and teamwork spirit. 有较强的研发项目的管理经验，沟通协调能力强，责任心及团队合作精神优秀。
5. Experience of low yield analysis and quality issue solving for new products. 具备低良率数据分析和质量相关问题的处理经验；
6. Experience of managing sub-contractors at different locations. 具备与各地外包商协作的经验；
7. Proficient in the use of various test instruments, including but not limited to semiconductor curve tracer, oscilloscope, discrete tester, etc. 精通各种测试仪器的使用，包括但不限于晶体管特性图示仪，示波器，分立器件测试机等；
8. Good communication and coordination skills, ability to withstand pressure, strong sense of responsibility and execution ability. 有良好的沟通协调能力，抗压能力，工作责任心和执行力佳。
9. Good English reading, writing, listening, and speaking skills, can smoothly communicate with foreign colleagues. 良好的英语读、写、听、说能力，能与外国同事顺畅沟通。