Job Description:
Drives and develops testability and manufacturability of integrated circuits from the component feasibility stage through production ramp. Contributes to design, development, and validation of testability circuits, test flows, and methodologies for new products through evaluation, development, and debug of complex test methods. Interfaces with process development, fab, factory, assembly, quality and reliability, and manufacturing groups to enable post silicon HVM ramp. Evaluates new designs on automatic test equipment (ATE) and works with the design, DFx, and product development teams to debug functionality and performance issues to root cause. Performs ATE device characterization, utilizes that data to define datasheet specifications and performs yield analysis. Collaborates with designers to drive design for test/debug/manufacturing (DFT/DFD/DFM) features enabling efficient production testing of new products. Develops and debugs complex software programs to convert design validation vectors and drive complex test equipment. Creates and tests validation and production test hardware solutions. Tests, validates, modifies, and redesigns circuits to guarantee component margin to specification. Analyzes and evaluates component specification versus performance to ensure optimal match of component requirements with production equipment capability with specific emphasis on yield analysis and bin split capability.Leads and drives manufacturing readiness from fab, assembly, and test factory to support engineering sample and customer sample generation (ES milestones), wafer start planning, product qual execution strategy and capacity analysis, and assembly and test site certification activities. Works with fab, assembly, and test factory partners and planners to support production ramp.
Qualifications:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: 17 A Bachelor's or Master's graduate in Electrical Engineering, Electronic Engineering, Telecommunication, Automation and Control Engineering, Computer Engineering, or Computer Science.17 Excellent problem-solving, technical, team, and communication skills.17 Python and object-oriented programming skills would be an advantage for this position.17 Good English communication skills. Additional Qualifications:17 Working experience in semiconductor industrial, possess semiconductor HVM manufacturing process flow knowledge (where applicable)17 Experience working with cross-functional and cross-organizational teams (in different geos)17 Experience developing new and / or re-engineering business processRequirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.