About the role
The Plasma Dicing Engineer belong to R&D dept., works with between ATGD and BG, will locate in Guangdong and play a key role of Plasma Dicing project.
What you will do
1) Able to develop a robust plasma dicing/etching process using good process characterization methodology for new products.
2) Provide technical solution starting from development to establish robust package manufacturability and reliability.
3) Able to understand the material interaction with process.
4) Provide technical advice on plasma dicing/etching process related topics to both internal and external customers.
5) Able to draw the process integration risk and come with risk mitigation plan.
6) Demonstrate a technical leadership role in subject matter.
7) Drive the technical discussion with cross site peers.
What you will need
1) Must possess a Master/Degree in Mechanical design/Electronics/ Electrochemical/ Applied Physics or related discipline with minimum 15 years’ experience in assembly field as a process manufacturing or development engineer in a semiconductor or other relevant industry. At least 3-5 years' experience in plasma dicing/etching area in the career life.
2) Experienced in plasma dicing/etching process. Understand how to develop a robust plasma dicing/etching process for new products.
3) Hands-on plasma dicing/etching machine.
4) Solid knowledge in process characterization.
5) Solid leadership of cross-functional projects will be required to successfully solve complex unit process and/or integration challenges.
6) Willingness to take responsibility and ownership to aggressively focus on problems either individually or part of a larger team.
7) Excellent in verbal and written communication skills. Able to communicate in English.
8) Moderate travelling is required.
9) Capability to adapt to the company’s changing needs and priorities and be a self-motivated team player.
10) A disciplined use of statistical methods (Minitab, DOE, Technical report writing, FMEA & etc) is required.