1. Be responsible for the failure analysis of chips, including but not limited to electrical analysis, physical analysis, and chemical analysis, accurately determining the failure mode and mechanism.
2. Develop chip failure analysis plans, use advanced analysis tools and techniques to conduct in-depth analysis of failed samples.
3. Work closely with teams such as design, process, and test to collaboratively solve the failure problems that occur during the R & D, production, and application of chips, and propose improvement measures and prevention plans.
4. Write detailed failure analysis reports, clearly stating the failure cause, analysis process, and conclusion, providing strong support for product quality improvement and R & D improvement.
5. Track the latest failure analysis technologies and methods in the industry, and continuously optimize and improve the company's failure analysis processes and norms.
6. Participate in internal technical training and sharing within the company to enhance the overall failure analysis capabilities and levels of the team.
Requirements
1. Master's degree or above in related fields such as electronic engineering, microelectronics, materials science, with at least 8 years of working experience in chip failure analysis.
2. Familiar with chip manufacturing processes and flows, and have in-depth understanding of semiconductor physics and electronic circuits.
3. Proficient in various chip failure analysis equipment and techniques, and have the ability to independently conduct complex failure analysis.
4. Have good problem-solving skills and logical thinking ability, and be able to quickly and accurately locate and solve problems.
5. Have a strong teamwork spirit and communication skills, and be able to effectively collaborate with cross-functional teams.
6. Have good English reading and writing skills, and be able to read and understand professional literature.