Lead the FOL engineering team.(FOL processes: wire bond, wafer saw, die bond etc;)
Take in charge of process setup and optimization.

Build up production related SPEC, including SOP, purchasing spec and buyoff spec, training material etc.

Process improvement and material optimization for cost reduction

Taking leadership to fix FOL assembly issue

Support new material evaluation and release to mass production

Conduct training for Act as project Engineer for new package and new process development.

Bachelor degree or above, Major in Mechanical/ EE/ Automation/ Material Science, etc；


3+Yr working experience of IC packaging/assembly or IC substrate process.

Good knowledge on IC assembly process, equipment and material. Familiar with Flipchip and WLCSP will be highly preferred

Capability to achieve outperformance under pressure.

Good altitude and team work to assigned;

Good English communication (written and verbal)