工作职责:
1、Take charge of Hybrid /Fusion bonding process development
2、Response of Hybrid and Fusion Bonding process road map making
3、Co-work with PIE for bonding process experiment
4、Set up bonding process training package/system
5、Bonding tool evaluation
任职资格:
1、Mininumu 2 years experience of Wafer on wafer bonding technology development
2、Minimum 1 Hybrid bonding or Fusion bonding product development sucessfully experience is prefferred
3、Familiar with EVG or TEL Hybrid / Fusion bonding tool
4、EVG or TEL hybrid/Fusion tool design and development experice is preferred
4、Capable of studing bonding process with DOE independtly