工作职责:
1.To manage integration of all modules’ processes and the respective derivatives.
2.To provide a leading role in the developing, transferring and maintaining of advanced DRAM fabrication technology with good process capability and high yield.Lead new technology transfer from mother fab or process development.
3.Owner of new prototype lots and ensure 100% success rate.
4.Drive process robustness improvement by providing root cause analysis and and collaborate improvement actions to meet 100% wafer acceptance test (WAT) Cpk goal & Baseline D0 target.
任职资格:
1.Semi-conductor or physical and materials science background, >1 Year experience.
2.PIE, defect, metro, device, YE, process, equipment area, deeply understand process and equipment. DRAM experience and TD experience is preferred.
3.Good leadership and communication skill with all counterparts.
4.Decision maker for technical issue and excellent capability to lead team fix issue quickly.
5.Familiar with fab/TD flow, well project management skill
6.Familiar with transfer procedure and copy exactly philosophy