工作职责：
1、Take charge of Hybrid /Fusion bonding process development；
2、Response of Hybrid and Fusion Bonding process road map making；
3、Co-work with PIE for bonding process experiment；
4、Set up bonding process training package/system；
5、Bonding tool evaluation.

任职资格：
1、Minimum 2 years experience of Wafer on wafer bonding technology development ;（可接受力学专业2024届博士毕业生）
2、Minimum 1 Hybrid bonding or Fusion bonding product development sucessfully experience is prefferred;
3、Familiar with EVG or TEL Hybrid / Fusion bonding tool ;
4、Experience in EVG or TEL hybrid/fusion tool design and development is preferred.