Requirements:
85 min 10years working experience in power semiconductor .
85 Hands on skill for power semiconductor SMT process (Pink Vadu, Infotech, SMT reflow and die attach sintering process).
85 lots of experience for DOE and statistic analysis.
85 knowledge for power module (case, transfer molded) structure /technology trend, overall power packaging process and material property what is using for power package.
85 understand APQP process, DFMEA,PFMEA, Control plan. Good English communication and reporting skill(mandatory option)
Job description:
SMT process set up, DOE, Sample build, jig design, trouble shooting