MAIN DUTIES AND RESPONSIBILITIES:
Design and develop semiconductor equipment to meet system specifications (required by process/ automation requirements) that will involve, inter alia:
80Lead a team of design engineers in the design and development from module to machine conceptualization
80Carries out CIP programs to extend product life cycle, enhance product competitiveness, improve gross margins and lower COO
80Conduct reliability and feasibility tests on module/machine level
80Support Technical Sales in specs review, costing and product evaluation
80Support and resolve technical issues from the manufacturing and end users.
80Selection and sizing of standard components

EDUCATION AND EXPERIENCE
80Bachelor/ Master of Engineering with minimum 10 years relevant experience
803D solid Modeling, preferably Pro-E (others like Solid Edge, Auto Inventor, Mechanical Desktop, Solid Designer are also acceptable).
80Good experience in
1.Ultra High Precision machine design
2.High Speed Pick and Place mechanism design
3.Structural, kinematics and dynamic analysis and FEA simulation
4.Geometrical tolerance and dimensional analysis (e.g. stack up error)
5.Engineering material selection
6.Design troubleshooting
7.Application of analysis tools like FMEA, DOE