Position Description
According to customer’s needs to develop packaging solutions.

Carry out package design from feasibility study until final completion.

Communicate with Hardware engineer make sure manufacturability of designs.

Coordinate with supply chain management team and package/substrate factory to deliver product on time.

Position Requirements
Bachelor’s degree in electric engineering or related field.

Familiar with Cadence Allegro and CAD tools.

Have at least two years of PCB or SiP layout experience.

IC design house working experience is preferred.

Well understand substrate design rule.

Well understand of package procedure.

Advanced package design experience is a strong plus, such as fan-out, 3DIC, panel, and so on.

Good teamwork and communication skills.