一、职位概述（Job Summary）
负责整合工艺制造流程及量产工艺流程控制，CP 良率提升。
Responsible for integrating manufacturing processes and controlling mass production processes to improve CP yield.

二、职责（Responsibilities）
2.1 负责产品工艺流程及制定相关工艺参数规范，与相关部门协作完成CP、FMEA等文件编制修订，确保流程操作的规范化。
Responsible for product process, formulate related process parameter specifications, cooperate with related departments to complete CP, FMEA and other documents compilation and revision, ensure the standardization of process and operation.
2.2 处理产品异常问题及突发状况，找出相关的制程步骤或设备，整合所有资源解决工艺问题，确保生产正常稳定。
Handle product problems and emergencies, find out related process steps or equipment, integrate all resources to solve process problems, and ensure normal and stable production
2.3 分析产品在线品质和良率电性数据，领导相关人员实施改进方案，确保产品品质及良率持续改善。 Analyzed product online quality and yield electrical data, led relevant personnel to implement improvement plans, and ensured continuous improvement of product quality and yield.
2.4 负责工艺变更评估，新产品导入计划及实施,持续改善工艺流程，制订改善方案和计划，持续降低生产成本。 Responsible for process change assessment, new product introduction planning and implementation, continuous improvement of process flow, formulation of improvement plans and plans, and continuous reduction of production costs
2.5 负责客诉异常处理，及8D报告，对客户的问题进行反馈，通过与客户进行技术交流，对所存在的产品质量问题实施改进方案，满足客户对产品品质的要求。
Responsible for handling customer complaints and 8D reports, giving feedback to customers' problems, implementing improvement plans for existing product quality problems through technical communication with customers, and meeting customers' requirements on product quality.

三、任职资格（Qualifications）
3.1 教育背景（Education）
电子工程、集成电路、微电子专业大学本科及以上，有FAB TD 或 PIE相关的工作经验可适当放宽。
Bachelor's degree or above in Electronic Engineering, Integrated Circuits, and Microelectronics, with relevant work experience in FAB TD or PIE, may be extended appropriately.
3.2 工作经验（Work experience）
3.2.1有FAB TD 或PIE 相关工作经验五年及以上；
Five years or more of experience in FAB TD or PIE related work;
3.3知识和技能（Knowledge and Skills）
3.3.1 熟悉Bipolar, DMOS, CMOS,BCD 等一种或多种工艺流程，熟悉半导体器件知识，晶圆制造工艺，了解封装和测试，有设计公司产品导入和量产经验优先。
Familiar with one or more process flows such as Bipolar, DMOS, CMOS, BCD, etc. Familiar with semiconductor device knowledge, wafer manufacturing process, understanding packaging and testing, with experience in product introduction and mass production in design companies preferred.
3.3.2 熟悉APQP、FMEA、SPC基础应用，知晓PPAP, MSA 等质量应用工具；
Familiar with APQP, FMEA, SPC basic applications, familiar with quality application tools such as PPAP and MSA;
3.3.3 英语水平良好，能和海外客户沟通交流。
Good English proficiency, able to communicate and interact with overseas clients.
3.3.4 具备较强的沟通、协调能力，能快速融入团队。
Strong communication and coordination skills, able to quickly integrate into the team.