Job Summary:
We are seeking a highly skilled Failure Analysis Engineer to join our team. The ideal candidate will be responsible for performing detailed failure analysis to identify root causes and support risk assessment, enhancing IC failure analysis capabilities. This role requires strong analog IC failure analysis knowledge, semiconductor manufacturing processes, and failure analysis techniques.

Key Responsibilities:
1. Perform failure analysis on defect devices to quickly identify failure modes and root causes.
2. Utilize analysis tools such as OM, X-ray, Curve Trace, EMMI, OBIRCH, Thermal, FIB, SEM, and TEM to characterize failures.
3. Analyze EFA results in conjunction with circuits schematic and layout to localize failure.
4. Develop and implement PFA plans to find physical defect.
5. Prepare detailed failure analysis reports and participate in customer communication and issue resolution.
6. Develop and improve failure analysis methodologies to optimize analysis accuracy and analysis efficiency
7. Collaborate with cross-functional teams to implement corrective actions.

Qualifications:
1. Bachelor’s or Master’s degree in Microelectronics, Electronic Science and Technology, Electrical Engineering, Materials Science, or a related field.
2. Minimum of 3-5years of relevant experience in failure analysis within semiconductor.
3. Proficiency in using EFA and PFA tools and techniques.
4. Strong understanding of IC circuit testing principles and the ability to interpret test results.
5. Familiarity with semiconductor manufacturing processes, including wafer fabrication and assembly.
6. Knowledge of semiconductor failure mechanisms.
7. Knowledge of analog and digital circuits.
8. Strong problem-solving skills and the ability to independently handle failure analysis tasks.
9. Excellent logical thinking and analytical abilities.
10. Effective communication skills for cross-team collaboration and customer interaction.
11. Experience with power management products is preferred.