职责描述：
1.负责化学机械研磨和电化学无应力抛光工艺测试研发和创新；
Responsible for CMP and SFP test, research, development and innovation;
2.负责化学机械研磨与无应力抛光工艺集成的测试，研发和创新；
Responsible for CMP and SFP integrated process test, research, development and innovation;
3.负责机台日常维护测试，测试和可靠性测试；
Responsible for tool daily maintenance，test and reliability test;
4.负责工艺相关技术文献检索，分析和撰写；
Responsible for relevant technology document search, analysis and writing;
5.与机械，电气，软件工程师合作，负责机台设计，评估，测试，和改进；
Responsible for co-work with mechanical, electrical, software engineers to support tool design, evaluation, test, and improvement;
6.与客户合作，验收机台，工艺，及开发新工艺方案。
Cooperate with customer to qualify tool, process, and develop new process solution.

任职要求：
1. 3-5年铜互联或先进封装FAB、或设备商工作经验；
3~5years working experience in related field such as Cu interconnection process /equipment in FAB or in an advanced packaging factory or tool vendors;
2. 熟悉化学机械研磨CMP工艺和设备原理；
Familiar with CMP process and semiconductor tool working mechanism, or relevant electrochemical process;
3. 具有一定项目管理能力；
Good project management ability;
3. 硕士或本科，理工科相关专业；
Master or bachelor degree, major in science &technology or mechanical;
4. 擅长沟通并能适应一定程度加班。
Good at communication and for overtime work to complete tasks on time.