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封装工艺工程师
15-30万/年
人 · 本科 · 4年及以上工作经验 · 性别不限2024/09/18发布
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上海松江出口加工区茸华路211号

公司信息
豪威半导体(上海)有限责任公司

已上市/1000-5000人

该公司所有职位
职位描述
工作职责:
Responsible for [CLGA,& LCOS] product, process, process development, optimization and anomaly analysis, yield improvement and ensure smooth production.
Provide timely solutions for handling production anomalies to control quality and safety risks.
Responsible for process, process system document establishment and update, as well as related personnel training and assessment.
Responsible for new process development, new material evaluation. And new product development.
Set up Innovation continuous improvement team within the department or across departments to improve efficiency, cost reduction and other projects.
Ensure timely completion of all tasks assigned by superiors.
任职资格:
1. Familiar with semiconductor packaging technology
2. Proficient in D/A and W/B processes
3. Proficient in QC tools, SPC, FEMA, PPAP.
4. Work year requirement is over 5 year in camera model / semiconductor packing
5. Require strong responsibility, learn ability and well team work.
6. Good English read/write skill, well spoken language is priority.

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