About the role
61The Senior Process Development Engineer is responsible for Power Module process development to meet Business Group R&D roadmap.
61Scope: standard & customized power module including potted and molded types, focusing on large area dispensing/sintering and laser welding process development.
What you will do
61To work closely with different internal & external function team (Marketing/Application/ Design/Simulation/PJM/Operation) to support new package/new technologies projects and provide professional technical inputs.
61To develop new process technologies and enablers which will support company’s new products/new package roadmap.
61To timely support sample building oriented by product or development purpose with relevant equipment operation ability.
61To support all Business Group functions with SiC/GaN/IGBT power module package expertise.
61To support die validation and qualification for external die source selection or self-innovated die development.
61To innovate and output IP submission
What you will need
61Bachelor or master’s degree in Semiconductor Packaging, Physics, Materials Technology, Electronics Engineering or equivalent.
61At least 5 years of working experience in semiconductor domain and 3 years of power package (with SiC/GaN/IGBT) development experience.
61Familiar with the packaging technologies applied on mainstream power module such as TPAK/T2PAK/SSC/DSC/HPD/PIM.
61Proficient with advanced power module interconnection technology including SLID/Cu sintering/DTS/Large area sintering/USW/LSW etc.
61Good communication and problem-solving skills for efficient teamwork.
61Good emotion management and self-discipline.
61Result oriented and willing to explore new fields.
61Fluent oral and written business English.
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright
08 material and the word Nexperia03 is a registered trademark.
Nexperia is an Equal Opportunity/Affirmative Action Employer.
职位要求：
Same as above.

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