POSITION OVERVIEW:
The experienced candidate with suitable skills is required to carry out key tasks and to meet the deadline of the project. The successful candidate will work with high power chip technology development team to design and develop state-of-the-art technology and deliver world-class high-power chips on the market.
KEY RESPONSIBILITIES:
61Responsible to build technology platform for power device (IGBT/FRD) design and new technology development to meet customer requirement in a manufacturable and cost-effective way
61Responsible to improve the device overall performance for the existing products, in particular, to improve the device reliability and robustness
61Performing TCAD process and device simulations, and layout design
61Creating and maintaining design rules and generation rules when required using controlled procedures
61Responsible for engineering device test (static, dynamic, reliability, etc) and data analysis, part of manually testing might be involved
61Responsible to guide and work with chip and other function teams to meet timely deliveries
61Train and advance the skills of existing technical employees to expand their capability and responsibility
61Experience of IGBT design for EV/HEV application preferred
61Encourage and manage the process of producing technical publications and invention patents.
SKILLS/COMPETENCIES
(Top 3-7 most important/critical competencies needed for the job both soft and hard skills):
Hard Skills:
61Hand-on experience in power device design and technology development, fine geometry trench and thin wafer technology are necessary, 12” experience is a plus
61Proficiency in TCAD process and device simulation
61Understanding of power device physics, fabrication and characterization principles.
61Knowledge and experience in design for reliability and robustness of power devices.
61Ability to address design and engineering issues and to provide suitable solutions
61More than 8 years working experience in IGBT (or FRD) design and/or processing
61Proficient in reading English literature and writing in English
Soft Skills:
61Leadership skills in building and leading project teams in a global, intercultural environment– “exemplified engagement”.
61Master’s degree or above, major in Microelectronics or semiconductor related
61Good Communication skills in both oral and written English
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright
© material and the word Nexperia® is a registered trademark.
Nexperia is an Equal Opportunity/Affirmative Action Employer.
职位要求：
Same as above.
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