POSITION OVERVIEW:
The IGBT Chip Director is responsible for ensuring that high power device has the best and most competitive technology, both for operating in the present- day market and for stepping into the future. The suitable candidate is required to carry out key tasks and to meet the deadline of the project. The successful candidate will work with high power chip technology development team to design and develop advanced high-power chips.
KEY RESPONSIBILITIES:
61Coach, mentor, manage and recruit team members
61Responsible for the technological capability of the corporation, in particular ensuring that it has the best and most competitive technology appropriate for its business needs, taking into account both performance and cost.
61For future technologies that the industry is moving towards, the role should take the responsibility for guiding the business to make the right strategic choice of which is best suited to our business needs
61Ensure the R & D team achieve best-in-class results in terms of choosing the appropriate technology and design for any project, meeting agreed timescale and cost targets.
61R&D experience of the latest IGBT technology in 12” wafer fab is a plus
61Maintain specialist knowledge and strategic understanding of the future market needs, in particular the technology direction of the industry. Have a high degree of familiarity with relevant novel technologies that are being worked on by competitors, potential technology partners, and in research and academia, and based on that be able to offer guidance and advice to the business on the choice of future technology to invest in
61Take overall technical responsibility for the IGBT chip business: Ensure professional and high-quality output of all work from the IGBT chip design team. Take “dotted line responsibility” also for the output from technical members in other functions (e.g. Applications and Quality), in particular ensuring that technical communications to customers are of the highest quality and accuracy, projecting a professional image for the company. Maintain technology and product roadmap content, product portfolio and industrial strategy
SKILLS/COMPETENCIES
(Top 3-7 most important/critical competencies needed for the job both soft and hard skills):
61Hard Skills:
61Chip Design Director is both a managerial role and a highly technical and professional one
61Take responsibility for the continuous growth and advance of the technical capability within the company.
61Key technical representative of IGBT chip technology interfacing with external organizations
61Recruit suitable technology experts from outside to meet our needs for new innovative work.
61Train and advance the skills of existing technical employees to expand their capability and responsibility.
61Encourage and manage the process of producing technical publications and invention patents.
61Soft Skills:
61Excellent analytical skills and structured work approach
61Motivate team of engineers
61The job-holder needs to have excellent understanding of and insight into both the technical and business dimensions of package technology.
61He/she needs to operate with a high degree of self-confidence and commands the respect of his/her colleagues, in order to have the authority to make important decisions regarding technology options on behalf of the business.
61Excellent communication skills and a firm grasp of any discussion subject regarding our business and technology
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Nexperia is an Equal Opportunity/Affirmative Action Employer.
职位要求：
Same as above.
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