【工作职责】
1. SMT new technology development include new material & new machine survey.
负责SMT新工艺的研究及开发, 包含新材料及新机台评估。
2. New product process recipe and process flow definition, including machine model and material type, program create and maintain.
新产品SMT工艺参数制订和工艺评审，包含贴片选型, 材料选择，程序制订、维护。
3. Survey and estimate OSAT technology capability, process standard definition, package standard definition.
调研及评估 OSAT 半导体封装技术能力, 制定工艺过程及封装标准。
4.Fine pitch WLCSP bonding process development and introduction, package technology integration and project management, including TCB, LAB and LCB.
微小化IC键合工艺技术开发，技术整合及项目管理,包含热压键合,镭射键合。
5. Survey and estimate OSAT technology capability, process standard definition, package standard definition.
调研及评估 OSAT 半导体封装技术能力, 制定工艺过程及封装标准。
6. SMT process issue analysis, yield and efficiency improvement, cost simulation for new produce.
SMT过程问题分析，负责打线工序良率、效率提升，新品成本分析。
7. SMT document definition, training and testing operators.
SMT工序作业文件制订，培训、考核产线员工。
【任职资格】
1. Proficient in SMT process, machine and material.
精通SMT工艺、机型 和材料。
2. Have the SiP module SMT NPI or technology development experience more than 5years.
5年以上SiP模组封装新产品导入或开发工作经验。
3. Familiar with Solder printing, SMT mount, Water cleaning etc.
熟悉半导体封装工艺，如印刷、贴装、水洗，等工艺。
4. Well know substrate, solder paste, flux ,and other package material etc. Hands on skill for solder printing machine, ASM mount machine, Koses ball mount machine is proper.
熟悉类载板、锡膏，松香及其他封装材料，具备印刷机、ASM\贴片机，Koses,SSP植球经验更好。
5. Well know package design rule or package on package development experience is better.
熟悉封装设计规则或具有堆叠开发经验者优先。
6. Understanding statistical basic knowledge and understanding of DOE principles and methodologies, including factorial design and response surface methodology, to enable scientific and rational experimental design. The engineers need familiar with using statistical analysis software such as Minitab or JMP.
统计学基础，深入理解DOE的原理和方法论，包括因子设计、响应面设计等，以便能够科学合理地设计实验方案。 具有使用Minitab/ JMP等专业的统计分析软件，DOE实验设计和数据分析的能力。
7. Have good communication and teamwork skills.
良好的问题分析能力和沟通能力，团队合作能力。
8. 需要长期外派。