This senior technical contributor role will develop and resolve issues on advanced packages for high performance power semiconductor products with high reliability, low cost and mass production robustness by collaborating with multiple departments (Design, Assembly, Test, Reliability Engineering, Quality, Sales and Marketing Team) and suppliers/OSAT’s around the world.
Job description
61 Responsibility for packaging design on advanced high power discrete, muti-chip, stacked and module packages. 61 Analyze stress, thermal capability and electrical performance with in-depth knowledge of thermal-mechanical and electro-chemical interactions. 61 Define BOM, assembly process development, assembly specification and qualification per standard requirements. 61 Resolve package reliability and assembly issues with thorough knowledge in the whole assembly processes. 61 Analyze assembly process SPC, yield improvement, cost, throughput and capability analysis. 61 Collaborate with device design / product engineering teams and external high volume packaging vendors to achieve qualification target 61 Lead package development projects to establish package manufacturability and reliability 61 Collaborate with cross functional teams to help develop a packaging roadmap aligned with the company’s product strategy and revenue targets.
Qualifications 61 BS Degree in Electrical Engineering, Mechanical Engineering and Material Science 61 Minimum experience 10 years in semiconductor packaging technology with hands-on design for manufacturability. 61 Experience in semiconductor, microelectronics, direct bonded or plated Cu isolation, power packaging and assembly engineering including high current clip, various wire bonding and module assembly preferred. 61 Experience to lead a project (program management). 61 Fluency of ACAD software. 61 Familiarity of package related design/simulation software (thermos-mechanical, thermal and electrical). 61 Excellent problem solving skills, an analytical approach to tasks and understanding of SPC techniques 61 Extensive experience collaborating with OSAT vendors/suppliers, Experience in building a supply chain of vendors and service providers. 61 Experience in SMT or passive integrated package assembly, multichip, stacked dies packages and assembly automation. 61 Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach (Solder and epoxy), Wire-bonding (Cu and Al bonding), Molding, and Package Singulation. 61 Experience in qualification of high voltage/power packages. Qualification in very high humidity and corrosive environment. 61 Knowledge of AEQ reliability requirements and APQP automotive development process 61 Knowledge of JEDEC/IPC design standards. 61 Strong in English oral and written communication skills.
