Day to Day Responsibilities: (must fill)
1. To plan, develop and support workstreams and tasks related to various projects in STS/P&W. (Semiconductor Technologies & Solutions/Packaging & Wafers).
2. Develop product/process capability of technology feasibility from development phase to pilot, scale up product/process capability of manufacturability from pilot to production and transfer to manufacturing.
3. Focus on fundamental understanding of polishing process/materials to design manufacturing process, optimize process consumable and generate mechanical designs.
4. Have knowledge of metrology methods to characterize geometry performance and surface performance.
5. Specify acceptance criteria between upstream and downstream processes to deliver clear handover specifications for product manufacturability.
6. Partner with mechanical design to develop prototype and production tooling.
7. Coordinate and complete FAT & SAT for new finishing tooling for production.
8. Lead fundamental process understanding projects to further finishing capability.
9. Integrate Design for Manufacturing (DF/X) methodology into bared glass product and process designs.
10. Transfer knowledge of new finishing process designs to manufacturing.
11. Coordinate IP management with the division IP portfolio manager by utilizing internal technical report, invention disclosures and patents.
12. Drive continuous improvements activities with project/program to deliver improved process, capabilities, delivery, quality and cost.
13. Work closely with project/program managers, supply chain, contract manufacturer, operations management team, functional leaders, engineers and commercial organization to establish work priorities and assignments for improvements in project/program efficiency.

Required Education: BS/MS degree with the following order of preference: Material science/engineering; Chemical engineering; Physical Chemistry

Desired Years and Area of Experience: >5yr work experience, including >1yr experience in manufacturing environment of semiconductor related industry is desired.

Requirements: Required Skills
1. Critical thinking to rapidly solve problems.
2. Strong written and oral communication skills in English and Chinese.
3. Desire to solve problems by leveraging Statistical/6-Sigma/DOE, Hypothesis Testing, root cause analysis and Hypothesis Tree problem solving methodologies.
4. Confidence in interaction with all levels of the organization, especially the communication to operation, commercial and division engineering.
5. Ability to function on a product development team of multi-disciplinary engineers.
6. Ability to deliver process statistical analysis via Minitab/JMP.
7. Ability to work cross-functionally with manufacturing, quality, supply chain, commercial and other functional leader as good team player.
8. Ability to transfer and integrate new technology into a manufacturing environment including process startup and technical knowledge transfer.
9. Ability to solving problem through troubleshooting on product or process related issues.
10. Confident presentation skills and ability to tailor message to audience.

Requirements: Optional Skills as a plus
1. Knowledgeable in material science and material analysis skill.
2. Knowledgeable in chemistry and chemical analysis skill.
3. Semiconductor CMP process control & development skill.
4. Finite Element Analysis or Computational Fluid Dynamics experience.