职责描述：
1.负责化学机械研磨和无应力抛光产品研发，创新，和迭代；
Responsible for CMP and SFP (Stress-Free-Polish) test, research, development, innovation, and iterative optimization;
2. 负责市场需求调研，制定设备标准和工艺标准；
Responsible for market and application demand research, develop tool spec and process spec;
3.与机械、电气、软件等设计部门合作，提供设计建议；
Responsible for co-working with mechanical, electrical, software design department, to provide design suggestion;
4.负责机台测试和工艺验证；
Responsible for tool test and process qualification;
5.负责工艺相关技术文献检索，分析和撰写；
Responsible for relevant technology document search, analysis and writing;
6.与客户合作，验收机台，工艺，及开发新工艺方案
Cooperate with customer to qualify tool, process, and develop new process solution.

任职要求：
1. 8年以上CMP设备商工艺或设备经验、或Fab CMP设备和工艺工作经验；
＞8years working experience in CMP tool vendor process or service, or Fab CMP equipment or process;
2. 熟悉化学机械研磨CMP工艺，半导体设备原理，或电化学工艺；
Familiar with CMP process and semiconductor tool working mechanism, or relevant electrochemical process;
3. 具有项目和工程师团队管理能力；
Good project and engineering team management ability;
4. 硕士或本科，理工科相关专业；
Master or bachelor degree, major in science &technology or mechanical;
5. 擅长沟通并能适应一定程度加班；
Good at communication and for overtime work to complete tasks on time。