工作职责:
Job Overivew:
● Package engineer work with supplier and OVT internal teams to solve assembly process related issue, yield improvement and cost-effective and safe packaging for products.
● Responsible for IC Package development, qualification, and volume production

● Perform package feasibility studies for all NPI (new product introduction) and direct interface with multiple assembly subcontractors as well as die design groups, product engineering, marketing and business units
● Perform technical assessments at supplier’s facilities
● Conduct risk and capability assessment to assign appropriate actions and tools for supplier development
● Drive a quality culture aligned to Zero Defect with suppliers for automotive process
● Evaluate and develop new packaging materials and processes
● Interface with packaging assembly and substrate suppliers for new product bring-up, qualification and production ramp
● Work close with QA and customers to resolve quality issues

任职资格:
● At least 8 years of assembly and packaging engineering experiences including advanced pkg development is required
● This job requires travel that may be for extended periods
● May be required to work extended hours on occasion
● Good project management, communication and leadership skills
● Experience with System In Package requirements preferred
● Knowledge of InFo and CoWoS technology preferred
● Knowledge of Lithography and Etching process concept preferred