Main Responsibilities
1. Involve in RF antenna & RF related unit design and their functional test to achieve stable, uniform and high - density plasma in a large - scale process chamber;
2. Optimize process and/ or drive ClP to improve current generation plasma chamber. Identify the most suitable plasma technology and conduct C&F (concept &Feasibility) test to define requirements for next generation chamber;
3. Deep dive with engineering team to prototype next gen chamber based on defined requirements. Evaluate proto chamber for multi-applications;
4. Plasma technology &process subject-matter expect to guide account/field teams on tough plasma technical issues;

Key Requirements:
1. Bachelor degree or above, major in semiconductor, materials, physics, chemistry, etc.;
2. Good understanding of plasma physics and processes is essential;
3. Practical background on at least one type of plasma technology and its characterization is needed;
4. Familiar with common plasma characterization tools (such as OES, ion sensor, RGA, thickness measurement etc.) and methodology;
5. Positive work attitude and demonstrated ability to communicate effectively;