PRIMARY PURPOSE:
- To perform FEA simulations for datacom interconnect products.
- Simulate the behavior of glass fiber-reinforced plastic materials.
DUTIES & RESPONSIBILITIES:
- Characterize the mechanical properties of glass fiber-reinforced plastic materials (e.g., LCP). Develop FEA modeling techniques to accurately simulate these mechanical characteristics and correlate the results with experimental tests.
- Model and simulate the prediction of fiber orientation during injection molding process of polymer composite. Map the predicted fiber orientations and calculated material properties to Abaqus for structural finite element analysis.
- Lead the development of new products and direct the activities of multifunctional team(s) according to the priorities set by engineering management.
- Conduct and coordinate FEA simulations for high-speed interconnect systems.
- Recommend changes in designs or technical procedures.
- Provide input, ideas, and suggestions to create effective structural design guidance and documentations.
- Work in laboratory environment to obtain material property and capture force-displacement curve using Instron machine.
- Stay updated on emerging technologies in Mechanical Engineering for Data Center products, drive research in areas including interference fit, thermal aging and anisotropic material modeling.
- Publish technical papers and patents.
REQUIRED:
- B.S. in Mechanical Engineering or related field. M.S. or Ph.D. is preferred.
- 3+ years of Mechanical/Material Engineering Experience
- 3+ years of ABAQUS FEA Simulation Software Experience.
- 2+ years of experience in CAD software and product design, such as NX.
- Experience in composite glass fiber reinforcement plastic material modeling.
- Experience with injection molding tool, such as MoldFlow or Moldex.
- Experience with glass fiber mapping tools, such as DigiMat or Converse.
- Experienced in mechanical testing for validation of simulation purposes are preferred
- Established records of invention such as patent ownership or technical paper authorship are preferred.