工作职责
1.To develop plasma dicing technology for dicing silicon wafers using DRIE silicon etching processes including etching recipe evaluation, experimentation and improvement to meet the technical requirements imposed by different product types.
2.To ensure integration of plasma dicing technology into existing back-end process flows by adjusting,developing and optimising other process steps such as laser grooving, die picking and die attach for best compatibility with the plasma dicing process conditions.
3.To manage the industrialisation of developed plasma dicing process flows and ensure transition to stable and robust volume production.
To make regular reporting on progress of the plasma dicing project using technical data and analysis and strong technical presentations to different levels of the organization.

任职资格
1.Ideally with front-end plasma etching experience, especially in silicon etching, but knowledge of other types of plasma etching processes appreciated.
2.Alternatively, any front-end processing experience in semiconductor manufacturing would be considered.
3.Knowledge of semiconductor laser processing would be an additional advantage.
4.Practical knowledge of tools for process development such as Failure Mode and
5.Effects Analysis (FMEA), Design of Experiments (DOE), Risk analysis.