Job Requirement:
1. 5 years & above working experience in semiconductor.
5年以上半导体行业工作经验
2. NPI project experience in Substrate base/ SIP (System in Package)/MEMS sensor packagings is preferred.
有基板/封装系统/MEMS传感器封装新产品导入项目经验者优先
3. Led or at least involved into new line establish/transfer/setup.
领导或至少参与新生产线的建立/转移/安装
4. PMP or GB/BB certification is preferred.
PMP或GB/BB认证优先
5. Strong logical thinking & good presentation skills.
较强的逻辑思维和良好的表达能力
6. Fluent English in writing, reading and speaking.
流利的英语读写能力
7. Communication with interpersonal skills.
沟通与人际交往能力
8. Well educated with project/time/conflict management & necessary QC tools.
熟悉项目/时间/冲突管理和必要的质量控制工具

Job Description:
1. Project timeline breakdown & actions follow-up according to APQP discipline.
根据APQP原则对项目时间表进行分解和跟进
2. Documentation check-up for each individual processes.
每个单独流程的文档检查
3. Coordinate the production system (MES, ER) set-up till complete testing and release to line, special for new process or station.
协调生产系统(MES, ER)的设置，直到测试完成并上线，特别是新工艺或新工位
4. Conduct the internal & external communication for technical requirements & alignments.
针对技术要求进行内部和外部的沟通并达成一致
5. Coordinate & submit for RFQ & risk assessment.
协调并提交询价和风险评估
6. Overall follow-up product qualification, sample & engineering build progress.
全面跟踪产品质量，样品和工程进度
7. Advanced technology development.
先进技术发展
8. Other tasks assigned by supervisors.
主管交办的其他工作