职位描述：
1. Assembly mold yields improvement .
提升良率
2. Driving assembly CIP for top defects and reduce O/S failure rate
驱动封装CIP，降低O/S故障率
3. Establish/ｕｐｄａｔｅ　Control Plan, FMEA, OCAP and SOP for process optimization.
建立/更新控制计划，FMEA, OCAP和SOP以优化工艺。
4. Customer audit handling and supplier qualification.
处理客户审核和供应商资格认证
5. Customer complaint disposition and 8D report preparation.
处理客户投诉，准备8D报告

职位要求：
1. Bachelor and above degree .
本科及以上学历
2. 1 years semiconductor mold process .
1年半导体塑封工艺
3.Good oral and written English.Good organizing &analytical skills .
良好的英语听说读写能力、组织能力、分析能力
4.Good communication and coordination spirit during work.
良好的沟通协调能力