任职要求：
1.Diploma qualification, major in electronics or mechanical is prefered
大专学历,电子或者机械专业优先
2.At least 2 years related DA or flipchip experience with semiconductor background is prefered.
有2年以上半导体Die attach经验者为佳
3.Familiar with ASM die bonder or ESEC die bonder 2100 is prefered.
熟练操作固晶机ASM系列或ESEC2100优先录取
4.Problem solving, good understanding and team spirit
具有团队合作精神及良好的沟通协调能力

岗位职责：
1.M/C major trouble shooting ,new M/C setup and follow up. Keep the M/C with smooth running.
解决设备主要故障，新设备设置跟踪，保证设备正常运行
2 Die Attach low yield analysis and assist engineer for process improvement
不良率分析，协助工程师进行工艺改善
3 Collect the needed M/C performance data and analysis，improve M/C availability.
收集及分析相关设备数据以提高设备的可利用率
4. To support full DA capacity
支持DA全容量生产
5. Carry on VOC reduction & production projects
实行减少客户投诉及生产项目
6. Other duties assigned by superior.
完成由直接主管指派的其他工作。
7.run Shift.
上四休二轮班工作制