主要职责：
1. 根据项目要求完成方案设计、原理图设计、PCB设计；
2. 负责元器件选型、参数计算、电路仿真等，完成电路设计可靠性评估；
3. 主导样机制作工作，完成产品调试；
4. 负责硬件BOM的建立和维护；
5. 负责量产阶段、客户端产品故障的分析，给出优化方案；
6. 负责硬件开发过程中相关文件的编写；
7. 协助产品测试、来料检验、生产测试等标准制定。
任职要求：
1. 三年以上嵌入式通信类产品或工控机类产品开发经验；
2. 熟悉各种主流ARM平台，FLASH、DDR等厂商产品；
3. 能独立完成多层板、高速通信布线、处理EMC问题；
4. 熟悉各种硬件通信协议，如SPI、RS232/485总线等；
5. 熟悉ARM、Cortex- M0/M3/M4应用；
6. 熟悉网络通信与无线通信（2.4G、zigbee、蓝牙等）；
7. 硕士学历，通信、计算机、电子信息等相关专业，实际工作能力强，可放宽要求。
Embedded Hardware Engineer (Communications)

main duty:
1. Complete the scheme design, schematic design and PCB design according to the project requirements.
2. Responsible for component selection, parameter calculation, circuit simulation, etc., and complete the reliability evaluation of circuit design.
3. Lead the production of prototypes and complete product debugging.
4. Responsible for the establishment and maintenance of hardware BOM.
5. Responsible for the mass production stage, the analysis of client product failures, and give an optimization plan;
6. Responsible for the preparation of relevant documents during the hardware development process.
7. Assist in the formulation of standards for product testing, incoming material inspection, and production testing.

job requirements:
1. More than three years experience in developing embedded communication products or industrial computer products.
2. Familiar with various mainstream ARM platforms, FLASH, DDR and other manufacturers' products.
3. Able to independently complete multi-layer boards, high-speed communication wiring, and deal with EMC problems.
4. Familiar with various hardware communication protocols, such as SPI, RS232/485 bus, etc.
5. Familiar with ARM, Cortex- M0/M3/M4 applications.
6. Familiar with network communication and wireless communication (2.4G, zigbee, Bluetooth, etc.)
7. Master degree, communication, computer, electronic information and other related majors, the restrictions can be relaxed with the strong practical work ability.