Job Requirement:
1.At least 1 years working experience in Semiconductor；
至少一年以上半导体相关经验
2.Experience with sawing,jig saw ａｎｄ tape saw is preferred；
有半导体切割经验者优先考虑
3.Problem solving skill is needed. Good understanding. Good team work
具有解决问题的能力，理解能力强并具有团队合作精神

Job Responsibility:
1.Responsible for EOL sawing process.
负责后段切割工序制程
2.Assist engineer to achieve efficiency, yield, cost ａｎｄ customer satisfaction
协助工程师在生产效率，良品率，成本及客户满意度方面达到要求
3.Other duty arranged by supervisor
由主管安排的其他工作职责
4.Run shift
上四休二轮班制