JOB DESCRIPTION:
1. Process evaluation and characterization for Plasma Cleaning, Promotion adhesive coating & cure, Mold, Post mold cure, Marking and Trim/Form02to achieve required power semiconductor product's time to market, quality, reliability, electrical and thermal performance, DFM,02DFQ, and Cost.
2. Material02seuvery02and evaluation for epoxy mold compound, adhesion promoter, tubes and packing material to achieve required power semiconductor's time to market, quality, reliability, electrical and thermal performance, DFM,02DFQ, and design for cost.
3. Generate process evaluation plan, execute, analyze, report compliance to company development procedures as well as02APQP02requirements
4. Plan out material and process evaluation, execute, analyze report to draw technical solutions to solve project technical problem to achieve project goal
5. To generate02AQPQ02deliverables of process and material for research and development02activites02to technical leader or product development leader

REQUIRMENT
1. Minimum 3 years in end of line semiconductor assembly process
2.Familiar with02APQP02and development procedures