Job description 1. Process evaluation and characterization for Plasma Cleaning, Promotion adhesive coating & cure, Mold, Post mold cure, Marking and Trim/Form to achieve required power semiconductor product's time to market, quality, reliability, electrical and thermal performance, DFM, DFQ, and Cost. 2. Material seuvery and evaluation for epoxy mold compound, adhesion promoter, tubes and packing material to achieve required power semiconductor's time to market, quality, reliability, electrical and thermal performance, DFM, DFQ, and design for cost. 3. Generate process evaluation plan, execute, analyze, report compliance to company development procedures as well as APQP requirements 4. Plan out material and process evaluation, execute, analyze report to draw technical solutions to solve project technical problem to achieve project goal 5. To generate AQPQ deliverables of process and material for research and development activites to technical leader or product development leader Requirement 1. Minimum 3 years in end of line semiconductor assembly process 2. Bachelor degree in engineering or science 3. Familiar with DOE, JMP or Unitab 4. Minimum basic level to communicate in English in written or oral communication 5. Familiar with APQP and development procedures 6. Base working location in Electric Voyage, ChangShu plant when working in the line and weekdays when there are tasks and meeting in the plant. The rest of days can work in RnD office in SIP, Suzhou 7. Willing to grow together with company 8. Master degree from university in engineering and science will get advantages
