任职要求：
1. Diploma and above degree and 5 years wire bond process experience.
大专及以上学历，5年左右WB制程经验
2. ASM & KNS (Iconn/Iconn plus) WB background will be preferred.
熟悉ASM&KNS机型为佳
3. Strong knowledge of statistics, DOE, FMEA,8D reporting.
了解DOE, FMEA,8D报告
4. Good oral and written English
良好的英文口语和书写能力
5. Good team spirit ,work hard and smart.
优秀的团队精神，工作认真，思路清晰


职责描述：
1. Responsible for new SPEC/sop making, equipment acceptance and buy - off, etc.
负责SPEC/ SOP / FMEA制定、新设备验收及buy-off、评估等
2.Responsible for the engineer s basic training (DOE experiments, use JMP, principle of parameter, etc.
负责工程师的基础培训（DOE实验，JMP使用，参数原理等）
3.Responsible for BGA (LGA) and QFN device import of new products, projects, the machine alarm rate, MTBA and yield improvement.
负责产品导入、专案、异常、MTBA及WB 工序的良率改善