Key Accountabilities ：
1. Take responsibility for half-bridge power module design, based on SiC MOSFET/Si IGBT.
2. Responsible for new product bare die selection, material selection, sub-parts design and incoming inspection specification.
3. Power module function testing, reliability validation, trouble shooting and failure analysis.
4. Take responsibility for new manufacturing process application like Sintering, informs soldering, epoxy molding compound.
5. TFC/TR with supplier about technical issue.
6. Support inverter team for power module application.
7. Tech interface between SGP, Kokomo and China Viper Team.
8. Other tasks arranged by manager.

Key Competencies：
1. Master or above degree in Semiconductor Engineering, Microelectronics, Electronic Information and Science, Physics, Materials Science, Material processing Engineering, Electronic packaging, etc.
2. 8 years’ work experience in power module design or related in semiconductor field, or OBC/DCDC power design.
3. Good knowledge of SiC MOSFET, IGBT, Diode and so on.
4. Good mindset of design guideline and summary.
5. Good teamwork and communication skill.
6. Good English skill for listening, speaking, reading and writing.