1.GTI-PI-API (Global Technology Innovation- Packaging Innovation-Assembly Process Innovation) is a research and development engineering team responsible for the design, development, execution, and/or implementation of packaging product, structures, or assembly process technologies 2.Investigates the feasibility of applying scientific and engineering principles and emerging technologies and capabilities to potential semiconductor packaging and assembly process offerings 3.Effectively develops or designs the implementation of these into manufacturing. 4.Maintains substantial knowledge of state-of-the-art principles and theories and may contribute to scientific literature and conferences 5.May also participate in development of patent applications 6.Maintains an understanding of the semiconductor market and effectively translates market requirements to packaging 7.API Tianjin department is focusing on IC package/process development 8.Major projects include development work on lead frame based and laminate based packages.
Requirements:
1.Master and PhD are preferred. Or bachelor degree with at least 1 year experience in packaging industry 2.Major on: Metallic Materials Engineering; Polymer Materials Engineering; Mechanical Engineering and Automation 3.At least CET-4 degree or equivalent English level and CET-6 is preferred 4.Intention and capability to work in a cross-functional/global team environment 5.Independent R&D capability 6.Experience in material analysis: EDX/SEM, AES, SIMS etc 7.Excellent English communication skill 8.Project management and team management experience in industry or in university social activities 9.Statistic analysis knowledge, 6Sigma GB/BB is preferred
