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高级刻蚀工艺工程师 - 武汉
1.6-2.3万·16薪
人 · 硕士 · 在校生/应届生 · 性别不限2024/11/07发布
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武汉市

公司信息
中微半导体设备(上海)股份有限公司

合资/500-1000人

该公司所有职位
职位描述
Key Responsibilities:13

1. Perform process development or modify existing process to meet customer requirement.
2. Compile and evaluate test data to determine appropriate limits and variables for process specifications.
3. Responsible for performing professional process engineering research, development, and evaluation in support of the company’s complex semiconductor capital equipment and systems.
4. May conceive and plan projects involving definition and selection of new concepts and approaches in the processing or development of new processes.
5. Feedback to design group, TPS and GPM for any new idea for chamber design improvement.


Key Requirements:

131. PhD or MS in Chemistry, Physics, Material Science or related fields;
2. Strong logical thinking, hands-on, presentation skills;
3. Self-motivator with sense of urgency and accountability;
4. Good communication skills, written and verbal, in both Chinese and English;
5. Proficient in MS Office products including PowerPoint and Excel;
6. Be able to travel domestically and international.

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