职位描述：
1、机械组件的设计，包括真空腔体、工艺气体和液体传输、真空系统、高温加热系统、冷却系统；
2、BOM表制作，技术文档编写；
3、管理供应商，开发新零件加工、测试、验收程序；
4、与生产部门合作，制定零件的组装、测试流程；
5、与电气、软件和平台等部门合作，设计开发安全可靠的系统；
6、配合现场工程师，解决客户端问题，并提供改进方案。
职位要求：
有半导体设备外延经验优先考虑。
1、机械工程专业本科或研究生以上学历；
2、5年以上半导体设备设计经验优先；
3、在结构设计、真空系统、气体液体传输系统、加热冷却系统、结构分析、机械制造加工等领域有扎实的基础。
4、熟练使用Solidworks和AutoCAD等制图软件；
5、能使用FEA软件进行辅助设计开发；
6、熟悉产品开发流程、掌握Agile等研发过程管控软件的使用；
7、解决问题能力和创新能力，积极的工作态度。
8、团队合作精神，较好的沟通能力。
General job description:
1. Design of mechanical components, including vacuum chamber, process gas and liquid transfer, vacuum system, high temperature heating system, cooling system.
2. BOM design, technical documentation drafting；
3. Suppliers managing, developing new parts machining, testing, acceptance procedures ； 4. Working with production department to develop procedures for parts assembly and testing；
5. Cooperate with electrical, software and platform departments to design and develop safe and reliable systems；
6. Cooperate with field engineers to solve customer problems and provide CIP solutions 。
Requirement:
1. Mechanical engineering undergraduate or Master degree or above；
2. More than 5 years experience in semiconductor equipment design is preferred；
3. With a solid background in the fields of structural design, vacuum system, gas-liquid transmission system, heating and cooling system, structural analysis, mechanical manufacturing and processing, etc；
4. Familiar with drawing software such as Solidworks and AutoCAD；
5. Know how to use FEA software to support product or parts design ；
6. Familiar with product development process, master the use of Agile and other R&D process control software；
7. With strong problem solving and innovation ability, positive work attitude；
8. Good communication skills and team cooperation capability 。