半导体封装Wire Bond 设备工程师(本科学历以上）
Job Description
Identify, diagnose and resolve assembly equipment related problems
Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step
Lead / participate in continuous yield improvement and cost reduction activities
Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction
Support SPC/FDC/RMS/APC
Support site to site portability
Manage / audit material suppliers to achieve quality, cost and risk management objectives
Support internal and external audits
Additional Job Description
Oversees the installation, modification, upgrade and maintenance of manufacturing equipment. Maintains current records on equipment manufacturers’ technical notices, upgrades and safety issues. Studies equipment performance and reliability. Establishes programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process. Provides technical support to the manufacturing equipment repair and process engineering organizations. Defines and writes preventative maintenance schedules.

As an equal opportunity employer, we recruit, hire, train, promote, discipline, and provide other conditions of employment on the basis of merit and free of discrimination without regard to a person’s race, religion, color, ***, national origin, age, disability, sexual orientation, veteran or other legally protected status. This includes providing reasonable accommodation for team members’ disabilities or religious beliefs and practices. Applicants are not required to pay employers', agents' or sub-agents' recruitment fees or other related fees for their employment.
作为倡导公平机会的雇主，美光始终遵循以平等、公平为原则来执行招聘、录用、培训、晋升及劳动条件设置等。该原则包括美光将不以应聘者或雇员的种族、信仰、国籍、性别、年龄等作为招聘、录用、培训、晋升及劳动条件设置的限制性条件。不要求团队成员支付雇主、代理或分代理的招聘费用或与其劳动关系相关的其他费用。