As a Global Quality (GQ) Package Reliability Manager in the Assembly and Testing Central Quality (ATCQ) at Micron Technology, Inc., You will be responsible for end-to-end management of new product, package qualification and HVM reliability monitoring at Micron, sharing results and issues with partners, driving improvements, providing and assessing risk in field and provide recommendation to MRB for disposition.
This role requires you to handshake and collaborate with Product Quality and Reliability Assurance (PQRA/DEMQRA), Supplier Quality Engineering (SQE), Customer Quality Engineering (CQE), Package Development Engineering (PDE), Product Development Team, Manufacturing, Supply Chain, Business, FAE, and other groups while handling and maintaining qualification, NPI end to end and HVM health.
You will also be responsible to drive qual failures and resolve timely manner, assess business and filed risk to release product timely. Drive shift left for early detection and improvement before starting NPI qualification.
This role also required to set up team objective and goals, review and drive improvement. Develop training plan and coaching team to bring up team skill and capability and continuous improvement.
Responsibilities:
Monitor qualifications, phase gates and monitoring status and drive improvement and resolutions.
Establish objective and goals for each team member aligned with departmental goals.
Communicate performance, reward and appraisal. Conduct performance analysis, coaching to improve performance. Provide recognition and drive accountability.
Define clear roles and responsibility, analyze resources, workload and optimize workload.
Proactively handshake with key partners on internal and customer issues and drive resolution.
Cultivate learning and development culture within team and department.
Plan department trainings and provide career development plan based on specific strengths and weakness.
Advocating and be role model for Quality Culture in Micron and Develop Quality approach.
Initiate departmental project focus on improving efficiency, process, new tests and product.
Qualifications & Skills:
Knowledge of Semi-conductor component and module assembly process. Direct experience related to DRAM assembly will be preferred.
Understanding of materials and reliability aspect of IC components and Printed Circuit Assemblies (PCB) assemblies.
Understanding of the effects thermal, mechanical and hygroscopic swelling stresses on package reliability.
Working level knowledge of reliability standards, acceleration models used for life predictions, and sampling statistics preferred.
Must be self-motivated, able to work independently, and detail oriented.
Strong analytical problem-solving skills, excellent multi-tasking skills and the ability to interact easily with other groups
Good written and verbal communication skills in English and Chinese.
Working knowledge of the computer, software, systems employed in assembly manufacturing is a plus
Education and Experience:
Required - bachelor's degree or above in engineering or related field.
Experience >5 years engineering and Related field of study.