职位职责：
1. DPS和后晶圆的建立和维护；包括后磨，黑锯，隐形切割，芯片安装（芯片对芯片/芯片对晶圆）回流焊，去焊剂清洁底填等工序；
2. 对接供应商，引进新客户实施和确认，确保新客户开发的完成；
3. 制定并跟进新车型的引进进度，确保在规定时间内完成；
4. 澄清客户需求和信息，确保新客户/新车型/QUAL LOT/工程变更满足客户需求；
5. 项目计划和实施的数据收集和报告整理，确保新产品按时推出；
6. 建立并确保新产品BOM的正确性，为客户提供正确的包装材料；
7. 提供各种产品信息和客户规格审查。

The job description as below
1. Establishment and maintenance of DPS and Post wafer;Including Back Grinding,Black Saw,Stealth Dicing, Chip mount(chip on chip/chip on wafer)Reflow,De-Flux clean.Underfill and other processes;
2. Connect with suppliers, introduce new customers into implementation and confirmation, to ensure the completion of new customer development;
3. Formulate and follow up the schedule of the introduction of new models to ensure that the schedule is completed within the time limit;
4. Clarification of customer needs and information to ensure that new customers/new models /QUAL LOT/ engineering changes meet customer needs;
5. Project planning and implementation data collection and report collation to ensure new product introduction on schedule;
6. Establish and ensure the correctness of BOM of new products and customers to provide correct packaging materials;
7. Provide all kinds of product information and customer SPEC REVIEW.