Key Responsibility：
1. Develop and design molds (fluid sealing & injection molding molds) required for new projects
2. Follow up the machining process of the mold to ensure the quality and delivery time
3. Responsible for the acceptance, trial production, problem analysis and optimization of new molds
4. Identify defects in existing molds (plastic sealing, injection molding, punching molds) and optimize them
5. Analyze and solve mold abnormalities that occur during the production process
6. Responsible for the daily maintenance and management of molds
7.Trainning to operator and maintenance technician
8.Good communication with material supplier of the products especially molding material

Requirement:
1. Familiar with mold & product structure and material characteristics, able to analyze whether the product structure is suitable for plastic encapsulation and injection molding
2. Familiar with the process principles of semiconductor fluid plastic encapsulation and injection molding
3. Familiar with the DFM process of mold design and independently complete the corresponding output
4. Proficient in 3D mold design and mold flow analysis software for EMC/MMC (better with this experience)
5.Experience in Semiconductor，molding technologies (Thermal plastic, transfer & compression mold) will be good
6. English can be used as a working language
7. More than 5 years of relevant work experience.