Principle Duties and Responsibilities:
61 Develop copper electro plating operation for volume production and integrate with semiconductor electronics packaging operation.
61 Oversee deployment and production ramp of plating operations including planning, licensing and safety operations.
61 Interface with local authorities as well equipment vendors for tooling start up and production.
61 Work with ATE in resolving packaging production ramp issues.
61 Support production operations for continuous improvement alongside production sustaining team.
61 Expand plating process capabilities to match new product demands.

Knowledge, Skills and Abilities:
61 Requires a BS/MS degree in Engineering with >5 years of related experience in the areas of semiconductor manufacturing, product engineering, packaging, quality engineering.
61 Must be well-organized, self-directed, self-starter, highly motivated, proactive problem solver with the ability to get results without owning resources and possessing direct authority. Must be willing to work with other individuals and teams to achieve corporate goals.
61 Experience in semiconductor production, in particular regarding electro-plating operations.
61 Familiar and experienced with problem solving methodologies such as DOE, 8D or PDCA.
61 Experience in Test and Process SPC beneficial.
61 Must be willing to travel internationally.
61 Position location at Chengdu, China reporting to Diodes Headquarters, USA.