工作职责: 1.To manage integration of all modules’ processes and the respective derivatives; 2.To provide a leading role in the developing, transferring and maintaining of advanced DRAM fabrication technology with good process capability and high yield.Lead new technology transfer from mother fab or process development; 3.Owner of new prototype lots and ensure 100% success rate; 4.Drive process robustness improvement by providing root cause analysis and and collaborate improvement actions to meet 100% wafer acceptance test (WAT) Cpk goal & Baseline D0 target. 任职资格: 1.半导体或物理与材料科学专业硕士背景,2年以上工作经验; 2.PIE、DEFECT、METRO、DEVICE、YE、PE相关方向,具有DRAM和TD经验者优先; 3.具备良好的领导能力和与跨部门的沟通技巧; 4.技术问题决策,并具备出色的领导团队快速解决问题的能力; 5.熟悉Fab/TD流程,具备良好的项目管理技能; 6.熟悉技术转移,了解研发转量产全流程。