工作职责:
1.To manage integration of all modules’ processes and the respective derivatives;
2.To provide a leading role in the developing, transferring and maintaining of advanced DRAM fabrication technology with good process capability and high yield.Lead new technology transfer from mother fab or process development;
3.Owner of new prototype lots and ensure 100% success rate;
4.Drive process robustness improvement by providing root cause analysis and and collaborate improvement actions to meet 100% wafer acceptance test (WAT) Cpk goal & Baseline D0 target.
任职资格:
1.半导体或物理与材料科学专业硕士背景，8年以上工作经验；
2.PIE、DEFECT、METRO、DEVICE、YE、精通任一Module PE相关方向经验均可，具有DRAM和TD经验者优先；
3.具备良好的领导能力和与跨部门的沟通技巧；
4.技术问题决策，并具备出色的领导团队快速解决问题的能力；
5.熟悉Fab/TD流程，具备良好的项目管理技能；
6.熟悉技术转移，了解研发转量产全流程。