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Application Engineer (IGBT/SiC chips)
2-3万·13薪
人 · 本科 · 5-7年工作经验 · 性别不限2025/07/31发布

南京市栖霞区广志路37号

公司信息
丹佛斯(中国)投资有限公司

外资(欧美)/5000-10000人

该公司所有职位
职位描述
Job Description



Investigation of IGBT and SiC chip technologies, development of inverter application samples, and support FAE for handling complex technical issues





Job Responsibilities



- Build test setup to investigate IGBT, SiC chip characteristics and performance
- Develop driver board to measure dynamic switching behavior of IGBT, SiC power modules
- Design inverter application samples to evaluation electrical and thermal performance of power modules
- Support FAE team for technical promotion and solving complex technical issues
- Competitor benchmark investigation in cooperation with Product Development





Background & Skills



Bachelor or Master degree in electrical engineering or a comparable field of study;
Over 5 years of experience in power electronics or application of power electronics;
Deep understanding of IGBT and SiC characteristics and switching behaviors, as well as reliability analysis of IGBT and SiC chips;
Able to identify and evaluate technical pros and cons of IGBT/SiC chips from different vendors;
Hands-on experience on IGBT/SiC testing, driver design, and inverter design, experience with 3L solar/ESS inverter design is preferable;
Fluent in English, able to write technical documents in English and participate in global technical meetings;
Teamwork mentality and good communication skills.

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