Investigation of IGBT and SiC chip technologies, development of inverter application samples, and support FAE for handling complex technical issues
Job Responsibilities
- Build test setup to investigate IGBT, SiC chip characteristics and performance - Develop driver board to measure dynamic switching behavior of IGBT, SiC power modules - Design inverter application samples to evaluation electrical and thermal performance of power modules - Support FAE team for technical promotion and solving complex technical issues - Competitor benchmark investigation in cooperation with Product Development
Background & Skills
Bachelor or Master degree in electrical engineering or a comparable field of study; Over 5 years of experience in power electronics or application of power electronics; Deep understanding of IGBT and SiC characteristics and switching behaviors, as well as reliability analysis of IGBT and SiC chips; Able to identify and evaluate technical pros and cons of IGBT/SiC chips from different vendors; Hands-on experience on IGBT/SiC testing, driver design, and inverter design, experience with 3L solar/ESS inverter design is preferable; Fluent in English, able to write technical documents in English and participate in global technical meetings; Teamwork mentality and good communication skills.