工作职责:
Position Overview:
1.CMOS image sensor technology development, including process integration, design rule scaling,device optimization, failure analysis, and yield enhancement.
2. Technical project management, working with cross-functional, cross organizational team to accomplish process set up, tapeout, yield demonstration, and reliability qualification on tight schedule.
Responsibilities:
1. New product tape out: New product device parameter and process capability evaluation; define the pixel layer special requirement.
2. Co-work with fab to develop reasonable process condition, create process flow.
3. Co-work with fab to develop process to improve pixel performance.
4. Process inline monitor: Co-work with fab to setup the special inline monitor for pixel layers.Take action if performance shifts.
5. Co-work with fab to do the process and mask layer costdown.
任职资格:
Experience & Skill:
1.M.S in E.E, materials science and engineering, 5+ years working experience in semiconductor industry.
2.In-depth knowledge on CMOS process integration and device physics.
3.Expertized in process control and improvement, data analysis, and problem solving.
4.Good coordination/communication/organization capability.
5. Be proactive and strong execution.
6. Fluent in both written and oral English.