【工作内容】
1.设计、执行并记录有关沉积工艺开发的实验；
2.规划、执行沉积工艺的表征工作，分析并记录结果；
3.与沉积产品团队密切合作，进行产品设计和性能提升；
4.为解决半导体加工技术中的关键问题提供创新的工艺解决方案；
5.编写培训文档和手册，并在实践操作或课堂环境中开展培训；
6.生成知识产权并撰写有关工艺、设备和装置集成的技术论文；
7.撰写并汇报项目进展情况。

【任职要求】
1.理想情况下，应具备工程或科学领域的博士学位，并有创新成果记录；
2.在半导体/设备工艺及制造行业拥有 3 年以上工作经验。有硅晶圆厂技术开发经验者优先；
3.具备扎实的 MCVD 工艺知识和丰富的实践经验；
4.熟悉薄膜表征技术（如 X 射线衍射、X 射线荧光、二次离子质谱、四点探针、霍尔测量、扫描电子显微镜和透射电子显微镜、光致发光、拉曼光谱等）；
5.具备半导体器件及工艺集成的基础知识是一项优势；
6.具备运用***性原理和实验设计技术（如实验设计）开发和表征沉积工艺的能力；
7.具备有效沟通的能力。

【Main Responsibilities】
Design, execute and document experiments on deposition process development.
Plan, execute characterizations on the deposition processes, analyze and document results.
Work closely with deposition product team for product design and performance enhancement.
Provide innovative process solutions to address critical problems in semiconductor processing technologies.
Create documents and manuals for training and conduct training in hands-on or classroom settings.
Generate IP and produce technical papers on process, equipment, and device integration.
Write and present project updates.

【Key Requirements】
Ideally PhD degree in engineering or science with track record of innovation.
3+ years in the semiconductor / equipment process & manufacturing industry. Technology development experience in a Si fab is preferred.
Solid knowledge and hands-on experience of MCVD processes.
Familiar with thin film characterizations (such as XRD, XRF, SIMS, 4-point probe, Hall measurements, SEM & TEM, PL, Raman etc) .
Fundamental knowhow of semiconductor devices & process integration is a plus.
Demonstrated ability to develop and characterize deposition processes using ***-principles and experimental design techniques (e.g. DOE).
Demonstrated ability to communicate effectively.